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Gap Pad VO Ultra Soft is an electrically isolating, thermally conductive interface material from Bergquist. Because of its low hardness and low modulus design it has an ultra conformable performance making it ideal for applications where minimal pressure on components is required and where a very uneven interface gap exists, air-gaps and voids being filled-in, minimising interfacial resistance and maximising thermal transfer. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbency.
The materials carrier is reinforced, making handling easier and helping to protect against puncturing, tearing and shearing, and the material also has an inherent surface tack on one side which enables easier placement and conversion.
Breakdown Voltage | 6000V |
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Material | Low modulus polymer |
Package/Case | 16 x 8 x 0.08in |
Temperature Range | -60 to +200°C |
Thermal Conductivity | 1W/m-K |