A quick drying, mildly activated (RMA type) no-clean flux for use when removing and replacing surface mount components. Particularly recommended for precision products e.g. telecommunications or professional computers where a high degree of reliability is required.
Aids reflow when heating to remove components
Apply to solder pads for placement of new components
Use as an anti-tarnish, protective film on bare copper
Provides excellent solderability for up to six months
Zero halide content so no cleaning is required
Passes copper plate and copper mirror corrosion tests
Use with hot air, hot gas or conventional soldering
Unfortunately re-reeling is not available at the present time for this item as the required quantity is greater than the available stock.
Re-reeling orders placed after 16:30 will be processed the next working day.
Unfortunately re-reeling is not available at the present time for this item.
Price per unit {{ IncVat ? 'Inc' : 'Ex' }} VAT
This product will not be replenished, however, you may buy the remaining stock.
Reviews
Really helps with solder flow
Reviewed by: Sales Sales - 28 January 2021
This makes a huge improvement when soldering lead-free joints. The solder flows much better and faster. The difference is amazing. One pen lasts for a very long time indeed if you take care of the tip.
