Future 315 low-residue, no-clean flux is a 2% solids colophony (rosin) free and halide-free flux, suitable for most no-clean soldering applications.
- Low residue
- No-clean flux
- Improves soldering performance - no bridges or icicles
- Reduces costs as no cleaning is required
- Offers excellent solderability with minimal level of flux residue
- Suitable for spray or foam fluxing systems
- Suitable for conventional, mixed and surface mount technologies
- Applications include telecommunications, computer and general consumer electronics
- Supplied in a 500ml bottle
| Dispensing Method |
Bottle |
| Flux Type |
No clean |
| Volume |
500ml |
| Weight |
500g |
Order Code: {{product.ProductCode}}
Your Ref: {{product.CustomerCode}}
MPN: {{product.ManuPartNo}}
![]()
![PCB Symbol, Footprint or 3D Model]()
- {{attribute.Name}} : {{decodeHtml(attribute.Value)}}
- ROHS : Compliant
- ROHS : Exempt
- ROHS : Non Compliant
Available for re-reeling
Unfortunately re-reeling is not available at the present time for this item as the required quantity is greater than the available stock.
Re-reeling orders placed after 16:30 will be processed the next working day.
Unfortunately re-reeling is not available at the present time for this item.
Price per unit {{ IncVat ? 'Inc' : 'Ex' }} VAT
This product will not be replenished, however, you may buy the remaining stock.
To use this facility please Sign In.
Sign In
