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Gap Pad 2500 is an electrically isolating gap-filling material from Bergquist that features medium compliancy and conformability, which is improved by the material being unreinforced. Good wet-out and interfacing characteristics to rough and uneven surfaces also ensure high thermal transfer.
This light brown material is inherently tacky on both sides which allows for easy handling and assembly and, together with its excellent performance characteristics, make this material particularly suitable as a replacement for clip- and screw-mounted assemblies in such applications as: multiple heat generating components to a common heatsink, graphics/processor chips to heat sink interface, mass storage devices and wireless communications hardware.
Breakdown Voltage | 6000V |
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Material | Low modulus polymer |
Package/Case | 4 x 4 x 0.04 |
Temperature Range | -60 to +200°C |
Thermal Conductivity | 2.7W/m-K |