Multicore / LOCTITE SN62RA10BAS86 solder paste has been formulated as an active product for printing and reflow in air. It offers good open time, high soldering activity and good printing quality.
The paste contains an RA type activator and is suitable for high volume production processes using components and boards, which have less than desirable solderability. SN62RA10BAS86 may also be used as a no-clean solder cream.
62/36/2 Sn/Pb/Ag alloy
Melting point 179°C
High activity to deal with poor component solderability
Suitable for printing and dispensing applications
Good slump resistance, tack performance and printer open time
