Solderless Breadboard allows components to be easily connected together into circuits and used time and time again for experiments and prototyping.
This transparent topped version allows visibility of the contacts and how they are connected together, making it ideal for use in training and education.
- Solderless concept allows components to be used again and again
- Ideal system for teaching electronic systems and circuit design
- Components are plugged into the board and are retained by double-leaf phosphor bronze nickel-plated spring contacts
- Sockets are on a 2.54mm matrix, allowing dual-in-line integrated circuits, plus many other components to simply be plugged into the board
- Two sets of 30 rows of 5 interconnected contact sockets
- Allows up to 4 connections to each pin of ICs placed across the central gap
- 2 rows of 50 contacts for power supply distribution
- Total of 400 tie points
- All contact positions are clearly defined on an coloured alphanumeric grid
- ABS polymer board mounted on an adhesive foam base
- Accepts components with wire sizes from 0.288 to 0.841mm (29 to 20 AWG)
- Dimensions: 83.5 x 54.5 x 8.5mm
- Boards can be slotted together for larger circuits
| Type |
Breadboard |
| Board Thickness |
8.5mm |
| Colour |
Transparent |
| Grid Pitch |
2.54 |
| Length |
83.5mm |
| Material |
ABS polymer |
| Tie Points |
400 |
| Width |
54.5mm |
To use this facility please Sign In.
Sign In
