Fortex RF100 Batch Reflow Oven, Soldering Convection SMT Oven

The RF100 Batch Re-flow Soldering oven is a practical bench/desk top size re-flow oven for the manufacturing and reworking of SMT Surface Mount products using SMD. This Batch reflow oven has a large intuitive operating display. Menu navigation is controlled via a membrane keypad.
The RF100 batch re-flow soldering oven utilises highly efficient infrared heating elements and has several thermocouple temperature gauges. Due to these features, combined with the precise evaluation in the microprocessor, the temperature curve of the reflow process is very accurate, and the temperature in the respective re-flow sections is uniform.

This product has a variety of applications such as reflow soldering, repairing, prototyping, drying, gluing and so on. It is suitable for SMT small series, for research and development of electronic products, education and study.

• Designed for re-flow of solder paste or polymerisation of prototyping glues
• Heating system suitable for Lead and lead-free and high temperature alloys
• Large window panel keeps Circuit Board in view during processing
• Software package included, allows programming, control and monitoring of the re-flow oven from a PC
• Suitable for processing of both single and double sided PCB SMT boards
• Compact housing design with generous 350x300mm working area
• Maximum working height of 80mm
• 5 Programmable phases for the re-flow process
• Constant heat mode option
• 4 Program memory complete with LCD Graphical display for temperature & time
• Simple programming for intuitive control
• Heating using forced air convection
• 4 Infrared quartz heating elements
• Software to allow real time Thermal Profiling, control and monitoring of the oven via a PC connected via USB
• Microprocessor controlled temperature up to maximum 300°C
• Thermic stabilisation time is approx. 3 minutes
• Mains powered, Single Phase IEC Inlet
• Fortex type RF100

Note: It is recommended that the oven is used with a suitable fume extraction station.

Type	Reflow Soldering Oven, SMT
Max. PCB/Panel Dimensions	350 x 300mm
Noise Level	50dBA
Power consumption (max.)	2.4kW
Supply Voltage	230V AC 50/60Hz
Temperature Range	60 - 300°C
Unit Dimensions	504 x 500 x 314mm
Weight	25kg